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Welcome to the PCBDesign007 E-Newsletter - Inside Design

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 Featured Columnist

Video Feature

  • The Shaughnessy Report: What's The Next Quantum Jump?
    Futurists are always trying to predict the next quantum jump in technology. The PCB manufacturing process is certainly due for a momentous change. Are printed electronics and the Occam process just what the futurist ordered?

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      Featured Video
     
    Video Feature

  • New Buds on the PCB Documentation Tree
    IPC's Director of Technology Transfer Dieter Bergman looks forward to fresh growth on an already well-established PCB specification, as IPC-2615 prepares to fold into the IPC-2610 documentation family. Dieter spoke with Guest Editor Kelly Dack at IPC APEX EXPO in Las Vegas.
  •   Guest Columnist

     Feature

  • The Sales Cycle: It's Never Perfect from the Start...
    As companies plan new products, services and strategies, if they were to wait for perfection, there would be no new products, services and strategies. This week's Sales Cycle explores idea implementation in our businesses.
  •   Contributing Author    

    Video Feature

  • The Bare (Board) Truth: Your Fabricator, Your Netlist
    What does your fabricator really want to know when he checks out your netlist? What's the difference between a netlist compare and a CAM 1 up compare? What are some common problems with netlists? For answers to these questions, read on.

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    Design News & Additional Information
     
  • Research and Markets Offers "ESD: Circuits and Devices"
    Research and Markets has announced the addition of John Wiley and Sons Ltd.'s new report "ESD: Circuits and Devices" to its offerings.
  • ANSYS Introduces Thermal Management Solutions
    The 12.0 release introduces new solutions for printed circuit board and package thermal analysis, new and enhanced technology for meshing complex geometr and new physical modeling capabilities.
  • Hitachi Cuts PCB P&R Time With Cadence GRE
    By utilizing Cadence's Global Route Environment technology for Cadence Allegro PCB Design, Hitachi has reduced place-and-route design time by 40% for a high-speed communication product.
  • Zuken Signs First E3.WireWorks VAR
    Zuken has signed the first E3.WireWorks value-added reseller (VAR), New Technology CADCAM (NTCADCAM). E3.WireWorks integrates the E3.series electrical design capability with SolidWorks 3D CAD software.
  • IPC: NA PCB Book-to-Bill Continues to Improve in May
    "After 12 consecutive months in negative territory, the book-to-bill ratio has finally climbed above 1.0 and that is good news for the industry. It is a good indicator of sales growth over the next few months. Sales growth is already starting to turn the corner," said IPC President Denny McGuirk.
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